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Integrated circuit packaging
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41	Techniques and Tools for Collaborative Thermal and Mechanical Modeling of 3D Ics Kamal Karimanal Cielution LLC Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:41:49 Electronics Electronic engineering Industrial engineering Three-dimensional integrated circuit Heat sink Packaging and labeling Technology Integrated circuits Semiconductor device fabrication
42	Microsoft PowerPoint - Standards Related to 3D Packaging (Jasbir Bath, IPC) [Compatibility Mode] Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-02-04 09:46:57 Electronics Three-dimensional integrated circuit Wafer Packaging and labeling Integrated circuit packaging Through-silicon via Semiconductor device fabrication Technology Microtechnology
43	Hint: fast, accurate and unrestricted exploration GSA 3DIC Packaging July 2014 E-System Design Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-07-24 00:32:10 Integrated circuits Semiconductor device fabrication Three-dimensional integrated circuit
44	Fides Sales - 3D packaging for GSA meeting - Ltec IMAPS excerpt Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-07-24 00:30:13 Electromagnetism Semiconductor device fabrication Fides Survival analysis Jitter Three-dimensional integrated circuit Signal integrity Application-specific integrated circuit Electronic engineering Electronics Integrated circuits
45	Components, Packaging, and Manufacturing Technology Society Newsletter THE GLOBAL SOCIETY FOR MICROELECTRONICS SYSTEMS PACKAGING cpmt.ieee.org Add to Reading List Source URL: cpmt.ieee.org Language: English - Date: 2015-03-06 09:16:21 Professional associations Standards organizations Technology Institute of Electrical and Electronics Engineers Universidade Federal do ABC Three-dimensional integrated circuit Bahgat G. Sammakia IEEE Components Packaging & Manufacturing Technology Society International nongovernmental organizations Engineering Electronic engineering
46	JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 15, NO. 3, JUNE[removed]Wafer-Level Packaging Based on Uniquely Orienting Self-Assembly (The DUO-SPASS Processes) Add to Reading List Source URL: www.ee.washington.edu Language: English - Date: 2006-11-13 22:12:11 Technology Wafer Etching Deep reactive-ion etching Microelectromechanical systems Three-dimensional integrated circuit Thermal oxidation Photolithography LIGA Materials science Microtechnology Semiconductor device fabrication
47	High-Performance FCBGA Based on Ultra-Thin Packaging Substrate By Katsumi KIKUCHI,* Jun SAKAI,* Koichiro NAKASE,* Hideya MURAI,* Hirobumi INOUE,* Hirokazu HONDA,† Keiichiro KATA† and Kazuhiro BABA* We developed a hi Add to Reading List Source URL: www.nec.com Language: English - Date: 2013-10-21 08:30:21 Semiconductor devices Semiconductor device fabrication Electronics manufacturing Electrical engineering Semiconductors Integrated circuit Ball grid array Printed circuit board Solder Technology Electromagnetism Electronics
48	Micro Technologies For more information on partnering with the Kansas City Plant, contact: Ofﬁce of Business Development Add to Reading List Source URL: honeywell.com Language: English - Date: 2012-04-26 07:29:47 Electromagnetism Microelectromechanical systems LIGA Semiconductor device fabrication Vertical-cavity surface-emitting laser Integrated circuit Back end of line Electronic packaging Technology Microtechnology Materials science
49	Microsoft Word - #17403-v27-CO_FTA_-_Annex_V_-_Rules_of_Origin.DOC Add to Reading List Source URL: www.efta.int Language: English - Date: 2015-01-16 06:37:10 International law Integrated circuit layout design protection Intellectual property law Rules of origin Packaging and labeling Business International trade Country of origin
50	SCREEN PRINTING FOR MEMS PACKAGING AND WAFER BONDING Contact Add to Reading List Source URL: www.enas.fraunhofer.de Language: English - Date: 2015-01-15 11:24:45 Semiconductor device fabrication Electronics manufacturing Printmaking Wafer Microelectromechanical systems Screen printing Solder paste Three-dimensional integrated circuit Stencil Microtechnology Technology Electronics

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